2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components.
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FAULHABER MICROMO - Game changer in logistics
Faster, more efficient, more sustainable - due to global competition in industry combined with booming online trade, transport structures in intralogistics are facing new challenges. The industries' answer: Automation. From storage to shipping, key work steps are being taken over by intelligent logistics robots, such as automatic storage and retrieval machines and driverless transport systems. To work efficiently and reliably around the clock, these robots need flexible and particularly compact drive solutions.
